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EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
There are a number of laser marking processes to choose from such as ablation, engraving, etching and more. Choosing the right method to achieve a permanent mark for your application depends on the material and type of mark required.
Toremain competitive and satisfy their customers, manufacturers face increasing demands for ever-faster delivery. To respond, more and more manufacturers are looking to looking to outsource some or all of their production to one stop shop advanced processing manufacturers.
Metal Processing Co., Inc. not only specializes in Hermiticity but also in Custom/Unconventional Sealing Requirements. From Housings, Feedthrus, Multi-port Headers, SMP/SMPM Shrouds and more.
Fairview Microwave’s line of integrated, 3.5 mm short-open-load-through (SOLT) 4-in-1 calibration kits are made-up of two models that have a 26.5 GHz calibration capability.
SemiGen announces new foundry capabilities and hi-rel screening services. Now offering wafer processing of 100 to 150 mm silicon wafers, as well as alumina and aluminum nitride substrates up to 4.25 in.
To prevent unwanted flow, many PCB designers will install dams formed of glass or other dielectric materials to keep solder from shorting active areas on a circuit. But there is another solder damming technique being rapidly adopted—laser ablation. Considered to be more accurate and consistent than traditional solder damming methods.
Although the commercialization of LTE technology began in end 2009, the technology is still being enhanced in order to meet ITU-Advanced requirements. This application note summarizes these necessary improvements, which are known as LTE-Advanced.
Since the year 2010 commercialization of the LTE technology is taking place. At the same time further enhancements of the LTE technology are worked on in order to meet ITU-Advanced requirements. This application note summarizes these necessary improvements known as LTE Advanced.
Modern radio communication systems have to provide higher and higher data rates. As conventional methods like using more bandwidth or higher order modulation types are limited, new methods of using the transmission channel have to be used. Multiple antenna systems (Multiple Input, Multiple Output – MIMO) gives a significant enhancement to data rate and channel capacity. This application note gives an introduction to basic MIMO concepts and terminology and explains how MIMO is implemented in different radio communications standards.
High Speed Downlink Packet Access (HSDPA) and High Speed Uplink Packet Access (HSUPA) optimize UMTS for packet data services in downlink and uplink, respectively. Together, they are referred to as High Speed Packet Access (HSPA). Within 3GPP release 7 and 8, further improvements to HSPA have been specified in the context of HSPA+ or HSPA evolution. This application note introduces key features of HSPA+ and outlines the changes to the radio interface.