Some impressive milestones in the world of Microwave semiconductors were noted this week. Among the proud recipients of industry and analyst recognition were NXP Semiconductor, RFMD (with an impressive Tier one GaN win), TriQuint and Peregrine Semiconductor. Here's a glimpse of some of the noteable announcements
Currently Featured in Microwave Journal: November 2009
Passive Components
Passives: Making an Impact
Overview of passive microwave component articles covering technologies applied to filters and power combiners/dividers/couplers
APMC dates back to 1986 in New Delhi, and it is now recognized as one of the premier international conferences of the microwave community. Singapore is proud to organize the 2009 APMC. This event will continue the spirit of APMC, address important issues in the microwave community, and network the region to the world. APMC 2009 will offer a rich scientific program of the highest quality with invited speakers from all over the world and provide a broad forum of exchange for both academia and industry alike. The conference will cover the entire scope of microwave engineering, including RF/microwave, antennas & propagation and EMC/EMI.
CST STUDIO SUITE version 2010 - A Real Breakthrough in High Frequency Electromagnetic Field Simulation November 18, 2009 Free 1-hour Webinar
System Design - Wireless Signal Propagation November 24, 2009 Free 1-hour Webinar
Asia-Pacific Microwave Conference (APMC 2009) December 7-10, 2009 Singapore
Radio Wireless Week 2010 January 10-14, 2010 New Orleans
New Products
Agilent Technologies:N2792A and N2793A Differential Probes Agilent Technologies introduces 200 MHz and 800 MHz, high-voltage differential probes. These differential probes provide superior general-purpose differential signal measurements required for today’s high-speed power measurements, vehicle bus measurements and digital system designs.
American Microwave Corp.:Programmable Attenuator: DVAT-0518-60-8-SK-193 This improved programmable 0.5 to 18 GHz attenuator incorporates a new driver
circuit with faster switching and more accurate attenuation. Low insertion loss and stable operation over temperature extremes. Switching between
all attenuation level is typically within 1 dB in 5 µs at 25 deg C. Sinewave scan modulation small and large signal bandwidth of 100 kHz and 50 kHz respectively.
Anritsu Company:Test Software for Emerging 3GPP LTE TDD Designs Three new software packages for use with Anritsu’s MG3700A Vector Signal Generator and MS269xA Signal Analyzer Series, expand Anritsu’s LTE test portfolio to include solutions that can accurately measure devices, chipsets, and equipment designed for either LTE TDD or LTE FDD (Frequency Division Duplex) mode: the MX370110A LTE TDD IQproducer, the MX269910A LTE TDD IQproducer, and the MX269022A LTE TDD Downlink measurement package.
AWR®:AWR Connected™ for Rohde & Schwarz The AWR Connected™ for Rohde & Schwarz integrates the capabilities of R&S WinIQSIM2 simulation software from the leading test and measurement manufacturer within its Visual System Simulator (VSS) system analysis software. The complete range of digitally-modulated signals generated by R&S WinIQSIM2, along with those already present within VSS, ensure that the same real-world test signals can be used throughout the design cycle.
RFHIC Corporation:Active Dividers AD311 & AD412 3- and 4-way active dviders for dgital TV and set top box applications. Covering 45-1000 MHz, with 8 and 6 dB gain, good gain flatness and noise figure, great VSWR & Linearity. AD311 is lead-free RoHS conforming device, using a low cost, SMD QFN 3x3 16 pin Plastic Package with a 5V single power supply. AD412 is a 4-way active divider. Both devices are matched for 75 ohm application, but 50 ohm applications including IF frequency and 800 MHz bands can also benefit by their full performance with only a small matching change.
Rogers Corporation, Advanced Circuit Materials:RO3730™ Laminate Materials Tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates, these ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance. The optimized blend of filler materials results in consistent dielectric constant across even large laminate panels, with low dissipation factor and high power-handling capabilities.
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ExecutiveInterviews
November 2009
Dave Whitaker of the Space & Defense Group, Anaren Microwave Inc., discusses his group’s recent strategic acquisitions and the resulting impact on the company’s competitiveness in the active assemblies and advanced PCB arenas.
Greg Friesen, Director of Product Management, DragonWave, a supplier of packet microwave radio systems for mobile and access networks, discusses “Network Engineering with Adaptive Modulation.”
Win:The first five contributors are eligible to receive a complimentary copy of the textbook: Electrical Engineering – A Pocket Reference from Artech House.
Guest Blogs
Sherry Hess, of AWR volunteers for IMS duty and finds herself on the MicroApps planning committee. Read her take on how this event within the show offers benefits to exhibitors and attendees alike.
Many applications require detailed knowledge of antenna performance as deployed in a realistic setting. To solve such problems the complementary capabilities of Remcom's XFdtd and Wireless InSite are highly effective and easy to use.
Jeff Owens of Agilent Techologies discusses how the N9030A PXA signal analyzer provides high performance functionality for next-generation microwave devices.
Alpha Test Corporation, discusses the role of fine-pitch probe test fixtures in supporting the development of miniaturized sub-asemblies where small test targets can be problematic.