Materials/Packages/Substrates

ECCOPAD® MetalTag is a true read on metal EPC Gen 2 compatible UHF RFID tag. Constructed using a tough elastomer and a patented material, MetalTag can withstand severe outdoor conditions and wide temperature changes.

A leading manufacturer of Spectrum Analyzers with CATV and QAM / Video demodulation and measurements capabilities turned to Emerson & Cuming Microwave Products to quell an EMI problem in one of their front-end modules.

This paper describes the regulations introduced in Europe that are driving electrical and electronic original equipment manufacturers to move towards non-bromine containing base materials and prepregs (pre-impregnated) to produce printed circuit boards, although the regulations do not acutally ban the FR-4 materials, only bromine content.

The reasons for selecting circuit board are threefold. First, to allow the integration of digital and Radio Frequency (RF) circuitry into a single assembly. Second, to decrease overall printed circuit board (PCB) size. Third to provide additional thermal paths and increase the rigidity of the final assembly.

With PTFE’s low loss and stable Dk characteristics, its use as RF Microwave printed-circuit board (PCB) substrate is well-established.

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The general definition of anistropy is variation in a given material property with respect to orientation.

Teflon(R) (PTFE microwave laminates are increasingly being used in both RF and digital designs. Higher frequencies and data rates require material with a very low electrical loss, cinsistent dielectric constant, and tight thickness tolerance.

Transmission line attenuation is known to be influenced by conductor surface profile (Rrms), an effect that worsens as frequency increases.

Product Selector Guide