Eric Boch, CTO and VP of Engineering at Dragonwave, Inc. looks at the changing hardware requirements for high capacity wireless backhaul especially among for Microcellular deployments for 4G.
Excellent Quarterly Results for Handset RF Front-ends
RFMD, Skyworks and TriQuint each posted the financial results for their recently completed quarters and all three experienced healthy growth compared to the same quarter from the previous year. Each company is undoubtedly the beneficiary of a strong demand for smartphones and wireless personal media devices.
European Microwave Week 2010 EuMW 2010, September 26 - October 1, 2010 Paris, France
The European Microwave Week consists of four conferences: The European Microwave Conference (EuMC); The European Wireless Technology Conference (EuWiT); The European Radar Conference (EuRAD); The European Microwave Integrated Circuits Conference (EuMIC). In addition to the conferences, the Week showcases a variety of workshops and short courses as well as the European Microwave Exhibition - the largest trade show on RF and microwaves in Europe.
MMIC Design Overview August 17, 2010 Free 1-hour Webinar
EuMW 2010 September 26-October 1, 2010 Paris
COMSOL Conference 2010 October 7-9, 2010 Newton
Products
Rogers Corp. Teams New RO4460 Prepreg with RO4360 Laminates
The company, a global leader in the development and manufacture of high performance, specialty-material-based products has developed the perfect prepreg match to its popular RO4360™ laminates: RO4460™ prepregs. Both materials feature consistent dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz.
MITEQ Inc.:Compact X-Band Power Amplifiers MITEQ has introduced a new line of low profile, lightweight and small volume high power X-Band amplifiers. The new PA family offers a unique combination of features and performance in an extremely small footprint. The high speed pulsed DC feature and 12 V supply allows for extremely efficient operation suitable for high temperature, portable or airborne applications.
COMSOL Inc.:Heat Transfer Module Problems involving any combination of conduction, convection, and radiation are solved easily with the Heat Transfer Module. It finds extensive use in systems that involve the generation and flow of heat in any form. A variety of specialized modeling interfaces are available.
JQL Electronics Inc.:Thincore™ Waveguide Isolators and Circulators The new Thincore™ line is designed for point to point base station application with ultra compact size and reliable performance. Key models include WR42 (17.6 to 19.7 GHz, 21.2 to 23.6 GHz) with 9.5 mm thick, WR 28 (37 to 40 GHz) with 12.7 mm thick and WR 62 (14.4 to 15.5 GHz) with 14 mm thick.
Special Hermetic Products:SMP Connectors Particular attention has been given to plating control to assure required plating thickness. Minimum plating on pins is guaranteed for wire and ribbon bonding. Limited plating on housing is assured to prevent gold embrittlement when soldering with Sn/Pb solders and also to preserve dimensional precision.
Anatech Electronics:Four-Way Power Divider AM900PD1196 Introducing the Model AM900PD1196 four-way power divider designed for applications such as wireless and Industrial Scientific and Medical (ISM) that operate between 800 to 1000 MHz. The module splits an input signal into four separate outputs, and features low insertion loss and excellent amplitude and phase balance.
Ansoft:HFSS HFSS is the industry-standard software for S-parameter and full-wave SPICE extraction and for the electromagnetic simulation of high-frequency and high-speed components. HFSS is widely used for the design of on-chip embedded passives, PCB interconnects, antennas, RF/microwave components, and high-frequency IC packages.
Dr. Ulrich Jakobus, Director of EMSS (FEKO), talks about his approach to software development and the company’s strategy for achieving a global presence.
Paul Colestock, RFIC EDA Product Planning at Agilent EEsof, talks about solving the RFIC Design for Yield and Verification Dilemma with GoldenGate in the Cadence Virtuoso design flow.
Basking in the sweet smell of engineering accomplishment - Christopher Marki of Marki Microwave talks about his company's new line of broadband Wilkinson power dividers and the joy of successful design.
Rohde & Schwarz enters the oscilloscope market with a tour de force product line that spans the measurement spectrum from 500 MHz to 2 GHz, offering sampling rates of up to 10 Gsample per second.
RFMD, Skyworks and TriQuint each posted the financial results for their recently completed quarters and all three experienced healthy growth compared to the same quarter from the previous year. Each company is undoubtedly the beneficiary of a strong demand for smartphones and wireless personal media devices. 
MITEQ has introduced a new line of low profile, lightweight and small volume high power X-Band amplifiers. The new PA family offers a unique combination of features and performance in an extremely small footprint. The high speed pulsed DC feature and 12 V supply allows for extremely efficient operation suitable for high temperature, portable or airborne applications. 
Problems involving any combination of conduction, convection, and radiation are solved easily with the Heat Transfer Module. It finds extensive use in systems that involve the generation and flow of heat in any form. A variety of specialized modeling interfaces are available.
The new Thincore™ line is designed for point to point base station application with ultra compact size and reliable performance. Key models include WR42 (17.6 to 19.7 GHz, 21.2 to 23.6 GHz) with 9.5 mm thick, WR 28 (37 to 40 GHz) with 12.7 mm thick and WR 62 (14.4 to 15.5 GHz) with 14 mm thick.
Particular attention has been given to plating control to assure required plating thickness. Minimum plating on pins is guaranteed for wire and ribbon bonding. Limited plating on housing is assured to prevent gold embrittlement when soldering with Sn/Pb solders and also to preserve dimensional precision.
Introducing the Model AM900PD1196 four-way power divider designed for applications such as wireless and Industrial Scientific and Medical (ISM) that operate between 800 to 1000 MHz. The module splits an input signal into four separate outputs, and features low insertion loss and excellent amplitude and phase balance.
HFSS is the industry-standard software for S-parameter and full-wave SPICE extraction and for the electromagnetic simulation of high-frequency and high-speed components. HFSS is widely used for the design of on-chip embedded passives, PCB interconnects, antennas, RF/microwave components, and high-frequency IC packages.
Dr. Ulrich Jakobus, Director of EMSS (FEKO), talks about his approach to software development and the company’s strategy for achieving a global presence. 
Paul Colestock, RFIC EDA Product Planning at Agilent EEsof, talks about solving the RFIC Design for Yield and Verification Dilemma with GoldenGate in the Cadence Virtuoso design flow.
Basking in the sweet smell of engineering accomplishment - Christopher Marki of Marki Microwave talks about his company's new line of broadband Wilkinson power dividers and the joy of successful design.
