The newly formed Wireless Gigabit (WiGig Alliance) hopes to spur the development of a wide variety of consumer devices that would be capable of sending high definition programming, data and other content over 60 Gigahertz (GHz) spectrum at speeds 10 times faster than current wireless networks. But the alliance isn't the only game in town.
Post-Show coverage continues... Catch the Microwave Journal Online Show Daily for the 2009 International Microwave Symposium held in Boston, MA, June 7-12. This year our coverage includes breaking news, Blogs/Twitter from IMS, MWJ exclusive editorial, exhibitor profiles, product showcase, videos and photos from the show. The post show wrap-up is now available.
European Microwave Week 2009 provides visitors with the opportunity to attend four conferences, various workshops, short courses and Europe's largest tradeshow for RF & Microwaves, the European Microwave Exhibition. The week provides an opportunity for both academia and industry to consider the latest trends and developments that are widening the field of application of microwaves.
4G World 2009 Conference and Expo September 15-18, 2009 Chicago
European Microwave Week 2009 September 28 - October 2, 2009 Rome
RF & Hyper 2009 October 6-8, 2009 Paris
AMTA 2009 November 1-6, 2009 Salt Lake City
IEEE COMCAS 2009 November 9-11, 2009 Tel Aviv
Radio Wireless Week 2010 January 10-14, 2010 New Orleans
Hittite Adds Wideband Direct Modulators for 3G and 4G
Hittite Microwave Corp. has introduced two new Wideband Direct I/Q Modulators that are ideal for automotive, broadband, cellular/3G, WiMAX/4G, military and test & measurement equipment applications between 20 and 4000 MHz.
Ansoft Corp.:SIwave 4.0 Part of the Ansoft family of products, version 4.0 of this technology includes new features for signal-integrity, power-integrity and electromagnetic compatibility testing. It includes numerous enhancements including an improved desktop graphical user interface with new post-processing of results, solver enhancements that provide accurate solutions beyond 10 Gb/s, and automation that links SIwave electromagnetics with circuit simulation using Ansoft Designer® and Nexxim®.
Carlisle Interconnect Technologies:HDSI® High-Density Shielded Interconnects High-Density Shielded Interconnects (HDSI®) cables are the perfect solution to a wide variety of demanding, high-speed applications. Whether in ATE, Servers, Backplanes, Telecom Switches or many more, the HDSI® cable is the lowest cost answer for your high-speed digital or analog signal transmissions.
CST of America Inc.:CST PARTICLE STUDIO® CST PARTICLE STUDIO® (CST PS) is a specialist tool for the fast and accurate analysis of charged particle dynamics in 3D electromagnetic fields. This software tool is based on the multi-purpose 3D EM modules in CST STUDIO SUITE™ such as the CST EM STUDIO® electro and magnetostatic solver. It is fully embedded in CST DESIGN ENVIRONMENT, thus benefitting from its intuitive modelling capabilities and powerful import interfaces.
Mini-Circuits:ZHL-16W-43+ High Power Amplifier Mini-Circuits ZHL-16W-43+ offers high power (16W) with rugged reliability over a broad frequency range from 1800 to 4000 MHz. This model includes temperature sensing circuits for automatic shutdown and output load protection to operate into a short or an open making it ideal for use in laboratory or field applications.
MITEQ Inc.:Instrumentation Desktop Amplifiers MITEQ’s latest offering in its instrumentation amplifier series, Models NSP2000-NVG, NSP4000-NVG and NSP4000-NFG, are now available with a frequency range from 0.1-40 GHz. Fixed or digitally controlled variable gain models are available. The variable gain models offer a digital control range of up to 15 dB with a step size of 1 dB.
Reactel Inc.:E-GSM Band Diplexer 2DP-EGSM-900 Reactel part number 2DP-EGSM-900 is a diplexer for the E-GSM Band. This unit features Passbands of 880 – 915 & 925 – 960 MHz with an in-band insertion loss of less than 1.2 dB. With 40 dB of isolation and minimum handling capability of 20 W, this unit is a great fit for your application.
Dr. Bernd Niedermann, Head of Corporate Communications at HUBER+SUHNER, explains the company’s evolution since its formation 40 years ago, its commitment to providing connectivity solutions and its strategies for developing new technologies.
Win:The first five contributors are eligible to receive a complimentary copy of the textbook: Electrical Engineering – A Pocket Reference from Artech House.
Guest Blogs
Follow RF Leonard Pelletier of Freescale Semiconductor as he shares his knowledge of all things technical from his years of RF/microwave design and application experience.
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Sherry Hess, of AWR talks about the impact of the wireless revolution on all aspects of life, extending as far as vacationland.
Among the changing landscape of RF/microwave semiconductor developments, devices with material properties that can sustain high electric breakdown are of particular interest. MWJ spoke to a number of leading vendors in GaN, LDMOS and other high voltage RF technologies.
A 10W GaN device from Cree achieved 81%record efficiencies using an active harmonic load-pull system. De-embedding the package and extrinsic device parasitics from measured waveforms allowed designers to establish the exact waveforms for optimum performance.