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A Systems Mentality Drives Next Generation MMIC Design
September 14, 2010; 11am ET
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Innovations in EDA: Discrete Oscillator Design
September 16, 2010; 1 pm ET
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Passive Component Technology
September 21, 2010; 11am ET
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Last Updated: 2:57 pm September 2, 2010 ET

Global Maritime Satellite Communications Market Passes $1 B

Euroconsult, an international research and analyst firm specializing in the satellite and space sectors, forecast that the number of satellite communications terminals aboard commercial and private ships will more than double over the next decade as demand for bandwidth on the high seas continues to surge.

Cree Demonstrates 150-mm Silicon Carbide Substrates

Cree Inc. announced that it has achieved a major breakthrough in the development and wide scale commercialization of silicon carbide (SiC) technology with the demonstration of high quality, 150-mm SiC substrates with micropipe densities of less than 10/cm2. The current Cree standard for SiC substrates is 100-mm diameter material.

WIN and Presto Engineering Announce Strategic Collaboration

WIN Semiconductors Corp., a pure-play Gallium Arsenide (GaAs) foundry, and Presto Engineering, a semiconductor product engineering company, announced a strategic collaboration to deliver characterization and testing services for companies developing products utilizing GaAs technology from WIN.

More Headlines:

Agilent Launches Measurement Applications, Expands LTE Leadership

Rogers Foams Division to Highlight Silicon Acoustic Barrier Product

Wireless Sensor Network IC Shipments Bounce Back in 2010

Microwave Industry Links Up with Andrew CNT Braided Cable

DARPA Solicits R&D for Cognitive Radio Low-energy Signal Analysis Sensor ICs

Cell Phone Antenna Troubles? Radio Frequency MEMS Come to the Rescue

Shipments of Short-range Wireless ICs to Increase 20 Percent

Tektronix Expands Instrument Service Offerings

TiaLinx Launches Eagle30-P

AVX Expands MLCC Family to Include Gold Plated Terminations

WiSpry Signs Joint Development Contract with NTT DOCOMO

Avago Completes LNAs for Cellular and LTE Base Stations

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AR RF/Microwave Instrumentation: Hybrid Power Amplifier Modules

AR’s new line of wideband, hybrid power amplifier modules (HPMs) cover the 6 to 18 GHz frequency range and are the result of combining microelectronic technology with the latest developments in thin film substrates. These hybrid modules require a single DC voltage source and are 50 ohm cascadable building blocks with output powers up to 37 dBm.

Skyworks Solutions Inc.: SMP1324-087LF and SMP1371-087LF: shunt PIN diodes

These series or shunt devices combine very low insertion loss, good isolation, unprecedented series diode power handling and low distortion in a very small package, and are designed for high-volume commercial, industrial and military radio communications systems such as land mobile radios, tactical radios, avionics and infrastructure markets.

Rohde & Schwarz: DST200 RF Diagnostic Chamber

The compact R&S DST200 RF diagnostic chamber makes it easy for developers of wireless devices such as mobile phones to perform reproducible radiated RF measurements on the workbench. The benchtop chamber simulates conditions that approximate free space and features a 700 MHz to 6 GHz broadband test antenna especially designed for the chamber.

RFHIC Corporation: GaAs p-HEMT LNA for S-band Applications

These low noise amplifiers are built with GaAs p-HEMT die attached on a ceramic thick film substrate. Alumina, the most commonly used type of ceramic, is what RHIC has chosen due to its relatively high thermal conductivity. These LNAs are focused on giving the lowest noise possible; exhibiting low noise performance of better than 1 dB noise figure.

AKON Inc.: Miniature RF Switches

AKON offers a line of high performance, high speed and high isolation miniature RF switches. These switches are available in standard configurations such as SPST through SP8T and higher. Switching speeds are typically in the order of 100 nanoseconds, but units under 10 ns are also available.

Aeroflex/Weinschel Inc.: 8310/8311-Series Programmable Attenuator Units

Representing a new concept in programmable attenuation for bench test and subsystem applications, standard 8310 Series designs house and control various Aeroflex/Weinschel Programmable Attenuator Models (3200T, 150T, and 4200 Series) via front panel controls or standard communications interfaces including GPIB (IEEE- 488) and RS-232/RS-422 /RS485.

Check out the Buyer's Guide for the most complete listing of product and company information for the Microwave industry.

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Exclusive Online Seminar

Passive Component Technology
September 21, 2010; 11am ET

Besser webinar Sponsored by:





Presented by Dr. Robert Froelich, Senior Principal Engineer at Cobham, this free 1-hour Besser-Series webinar will cover: ideal passive elements including inductors, capacitors and resistors; also real elements including construction, modeling and parasitics, frequency response and application suggestions.

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Exclusive Online Seminar

Innovations in EDA

Microwave Journal teams with Agilent Technologies in this series of online courses for working professionals.

Discrete Oscillator Design Tools & Techniques
September 16, 2010; 1pm EDT

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This webcast provides an easy-to-understand Unified Theory of Oscillator Design to demystify oscillators so that you can begin designs with a thorough understanding of oscillator behavior rather than by copying designs. This educational lecture is based on the 3rd and latest book on Discrete Oscillator Design authored by the presenter, Randy Rhea.

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Exclusive Online Seminar

A Systems Mentality Drives Next Generation MMIC Design
September 14, 2010; 11am ET

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This free 1-hour webinar will provide an overview of a new suite of systems-driven MMICs and their inspirations as they were developed by Endwave Corporation. Endwave’s unique position as both a MMIC integrator and MMIC designer has lead to some novel design approaches and cost cutting measures that may aid subsystem and system designers in overcoming their latest microwave and millimeter-wave challenges. Case studies for design challenges and solutions will be presented including increased performance and reliability at high frequencies, overcoming supply chain logistics while lowering costs, and enabling true full SMT solutions through high frequencies. Engineering professionals looking to reduce footprints and lower costs in multi-function assemblies and integrated systems will find this webinar both informative and educational.

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