Log-In | Sign-Up Now! It's Free! | Subscriber Services

 

Free Webinars

A Systems Mentality Drives Next Generation MMIC Design
September 14, 2010; 11am ET
Register Here

Presented by:

Innovations in EDA: Discrete Oscillator Design
September 16, 2010; 1 pm ET
Register Here

In Partnership with:

Passive Component Technology
September 21, 2010; 11am ET
Register Here

In Partnership with:

Advertisement

August 2009: Special Report

UltraCMOS RFICs Ease the Complexity of Satellite Designs

Commercial and military satellites require cost-effective ICs that meet stringent high-reliability standards. In addition, they need to provide distinct advantages that allow designers to advance satellite technology in order to meet changing needs, especially in terms of cost (weight, power), reliability (number of transmission lines, radiation tolerance, redundancy) and performance (including the ability to enhance opportunities for flexible payload designs using phased-array antennas or a switch matrix). Silicon on sapphire (SOS) is inherently a great match for these business and technical constraints, and is currently available in high-volume, high-yield commercial production.


A form of SOS technology that uses ultra-thin films, UltraCMOS™ technology is an extension of RF complementary metal-oxide-semiconductor (CMOS) technology that enables the manufacture of high-performance RF devices. Particularly important for satellites, this technology has low gate capacitance and fully depleted devices, which enables high speeds at low power. These devices also greatly improve linearity as compared to typical silicon on insulator (SOI) and GaAs technologies, and they offer 2 kV typical Human Body Model (HBM) electrostatic discharge (ESD) protection. Presently in high-volume production for commercial applications, UltraCMOS technology meets high-reliability and environmental requirements for operating in space and yields tend to be comparable to other CMOS processes.

Process Advantages for Satellites

Figure 1 Bulk Si process devices (top) have higher parasitics because of the thick layer of Si while UltraCMOS process devices utilize a thin 1000 Å Si layer.

CMOS technology’s advantages of low power and ease of integration are well known.1 UltraCMOS technology is a CMOS technology where a 50 to 100 nm silicon film is formed directly on a sapphire substrate. When properly processed, this provides for fully depleted devices with little or no body charge under the gate (see Figure 1). As compared to traditional CMOS processing, UltraCMOS offers the advantage of faster devices with reduced power loss, excellent linearity, high isolation and no kink effect. For satellite applications, this proves to be particularly valuable in the avoidance of single-event effects.


     

Interested in reading the complete article?
A complete view is available to registered MWJournal.com members.

Registration is FREE! Click here to register.

Already registered? Login >>

Already a member, but don't remember your username and/or password? Click here.

If you are a Microwave Journal monthly subscriber and would like to enable FREE Website access, please click here.

Join Microwave Journal on:

Bookmark and Share

Free Microwave Journal
Subcription

Related articles:

electronica 2010: The Entire Electronics Industry Under One Roof -- August 31, 2010
electronica 2010, which will be held at the New Munich Trade Fair Center from 9 to 12 November, will cover technologies, products and applications across the whole spectrum of the electronics industry from semiconductors and EMech components, test instruments and wireless systems, to embedded devices, PCB related services, optoelectronics and power sources. Automotive electronics, displays and e-signage or digital signage, embedded systems, medical electronics, MEMS, photovoltaics and renewable energies are just some of the topics that will be featured.

Microwave Tube Market Successfully Holding Off GaN Threat -- August 24, 2010
While microwave and millimeter-wave high-power vacuum electron devices (VED) remain “below the radar” of many industry observers, the total available market (TAM) for this segment is over $1 B.

RFM Announces Investment by Murata -- August 24, 2010
RF Monolithics Inc. (RFM) announced that Murata Electronics North America Inc. has purchased 533,000 shares of RFM Common Stock at $1.31/share, representing a small premium over RFM’s recent 30 day volume weighted average price, in a private transaction. The purchase represents less than five percent of RFM’s outstanding stock.



Global Maritime Satellite Communications Market Passes $1 B -- September 2, 2010

Cree Demonstrates 150-mm Silicon Carbide Substrates -- September 2, 2010

The Defence/Security Executive Forum at EuMW 2010 -- September 2, 2010

WIN and Presto Engineering Announce Strategic Collaboration -- September 2, 2010

Agilent Launches Measurement Applications, Expands LTE Leadership -- September 2, 2010

Other Horizon House Sites:

Microwave Journal Online: Home | Current Issue | News | Buyer's Guide | Events | Resources | Archives | Subscriptions | Privacy Policy

Advertiser Information:
2010 Media Planner

Find out why more companies advertise in Microwave Journal than any other publication in the industry.

Read More >>

Microwave Journal
Editorial Information

Editorial Planning Guide and Information for Authors

Read More >>


©2009 Microwave Journal & Horizon House Publications ® All rights reserved.