As we kick off the new year, the MWJ Blog looks at the economic news that should impact our industry. This is certainly a time where market focus is more important than ever and targeting growth markets and any other market opportunities that arise will be a key to success. In this type of economic market, we believe that new product development and targeted marketing are two key areas to concentrate on. We kick off the month with a report on the GaAs industry from Strategic analytics
Demonstration of the capabilities of a suite of electromagnetic and thermodynamic simulation tools for external hyperthermia treatments with a radio frequency phased-array heat applicator
The GSMA Mobile World Congress (formerly 3GSM World Congress) combines the world's largest exhibition for the mobile industry with a stimulating and insightful congress that brings together prominent leaders and personalities from mobile operators and equipment vendors, as well as Internet and entertainment professionals.
The convergence of more than 1,100 exhibiting companies, dozens of industries, and over 40,000 professionals from 125 countries all working toward the common goal of revolutionizing wireless.
IEEE Radio and Wireless Symposium (RWS 2009) January 18-22, 2009 San Diego
IWCE 2009 March 16-20, 2009 Las Vegas
Satellite 2009 March 24-27, 2009 Washington
The International CTIA WIRELESS 2009 Convention April 1-3, 2009 Las Vegas
CTIA Wireless RF/Microwave Zone April 1-3, 2009 Las Vegas
2009 World Radar Fair April 1-3, 2009 Beijing
WAMICON 2009 April 20-21, 2009 Clearwater
Skyworks 4G LTE Power Amplifier Module
Skyworks Solutions Inc. introduces a multi-mode and multi-band frequency division duplex (FDD)/time division duplex (TDD) power amplifier module (PAM) for fourth generation (4G) long term evolution (LTE) applications.
Freescale Semiconductor Inc.:MRF6VP11KH 1 kW Power Amplifier The recent launch of Freescale RF high power, high voltage LDMOS devices has made possible the design of kilowatt class power amplifiers in a compact format. It is targeted for high power applications using a single push-pull device in a symmetric configuration for use in MRI as a RF source building block for multi-kilowatt power amplifiers.
Hittite Microwave Corporation:HMC668LP3E and HMC669LP3E The HMC668LP3E and the HMC669LP3E are GaAs pHEMT MMIC Low Noise Amplifiers which are rated from 700 to 1200 MHz and 1700 to 2200 MHz, respectively. These compact LNA MMICs feature an integrated LNA bypass path which makes them ideal for infrastructure and subscriber applications where received signal strengths can vary significantly over time.
Huber + Suhner AG:Waterproof QMA Connectors QMA radio frequency connectors are equipped with a QUICK LOCK locking mechanism instead of a threaded connection. This snap-on coupling is fast, reliable, easy and space saving. Many network equipment manufacturers and installation crews can confirm the excellent characteristics of the QMA connector and are profiting from the reduced costs and time.
MegaPhase, LLC:MegaPhase® ZMA Bayonet Connectors Finally high volume cell phone manufacturers in China and throughout the world are reducing production downtime with MegaPhase ZMA connected test cables. The ZMA Series precision coaxial connectors reduce annual cable replacement rates from six per year to practically none by using bayonet coupling connectors instead of threaded connectors.
RLC Electronics Inc.:High Power Directional Couplers RLC Electronics’ high power directional couplers offer accurate coupling, low insertion loss and high directivity in a compact package. The standard units are optimized for 2 octave bandwidths and are available with a choice of coupling values. These units are ideal for sampling forward and reflected power with a negligible effect on the transmission line and very low intermodulation products.
Rosenberger Hochfrequenztechnik GmbH & Co. KG:RosenbergerHSD® Interconnect System RosenbergerHSD® is a symmetrical, impedance controlled 100 Ω interconnect system for transmitting data streams at high bit rates: The high performance digital system prevents interference through crosstalk and external sources. Performance is achieved by using an optimized shielding concept with complete braid connection to the outer contact of the connector.
Bryan Ingram Vice President and General Manager
Avago, Wireless Semiconductor Division
Ingram talks to us about the largest independent semiconductor company in the world, the wireless infrastructure market and the company’s many innovation especially in the area of micro-miniaturization.
Pierre Piel, applications engineer at Freescale Semiconductor, talks about some of the areas where microwave technology is being utilized in medical applications and what some of the performance requirements are for LDMOS devices.
Win:The first five contributors are eligible to receive a complimentary copy of the textbook: Electrical Engineering – A Pocket Reference from Artech House.
TestBench December 2008
Agilent’s Scanning Microwave Microscope is a breakthrough with the potential to make a significant impact. The company’s Vice President and General Manager of the Component Test Division (CTD), Greg Peters, tells Microwave Journal’s Richard Mumford how the instrument evolved, highlights its key features and outlines its health, environmental, semiconductor research and general electronics applications.
The recent launch of Freescale RF high power, high voltage LDMOS devices has made possible the design of kilowatt class power amplifiers in a compact format. It is targeted for high power applications using a single push-pull device in a symmetric configuration for use in MRI as a RF source building block for multi-kilowatt power amplifiers.
The HMC668LP3E and the HMC669LP3E are GaAs pHEMT MMIC Low Noise Amplifiers which are rated from 700 to 1200 MHz and 1700 to 2200 MHz, respectively. These compact LNA MMICs feature an integrated LNA bypass path which makes them ideal for infrastructure and subscriber applications where received signal strengths can vary significantly over time.
QMA radio frequency connectors are equipped with a QUICK LOCK locking mechanism instead of a threaded connection. This snap-on coupling is fast, reliable, easy and space saving. Many network equipment manufacturers and installation crews can confirm the excellent characteristics of the QMA connector and are profiting from the reduced costs and time.
Finally high volume cell phone manufacturers in China and throughout the world are reducing production downtime with MegaPhase ZMA connected test cables. The ZMA Series precision coaxial connectors reduce annual cable replacement rates from six per year to practically none by using bayonet coupling connectors instead of threaded connectors.
RLC Electronics’ high power directional couplers offer accurate coupling, low insertion loss and high directivity in a compact package. The standard units are optimized for 2 octave bandwidths and are available with a choice of coupling values. These units are ideal for sampling forward and reflected power with a negligible effect on the transmission line and very low intermodulation products.
RosenbergerHSD® is a symmetrical, impedance controlled 100 Ω interconnect system for transmitting data streams at high bit rates: The high performance digital system prevents interference through crosstalk and external sources. Performance is achieved by using an optimized shielding concept with complete braid connection to the outer contact of the connector.
Bryan Ingram
Pierre Piel, applications engineer at Freescale Semiconductor, talks about some of the areas where microwave technology is being utilized in medical applications and what some of the performance requirements are for LDMOS devices.
Agilent’s Scanning Microwave Microscope is a breakthrough with the potential to make a significant impact. The company’s Vice President and General Manager of the Component Test Division (CTD), Greg Peters, tells Microwave Journal’s Richard Mumford how the instrument evolved, highlights its key features and outlines its health, environmental, semiconductor research and general electronics applications.
